The contact angle meter SURFTENSHL is designed for use in semiconductor industry and research, in particular for process control of wafer coating and in the photolithographic process.

 

 

 

It is characterized by the following features:

fast and easy measurement of contact angle,

space-saving construction

special table construction for fast mapping of contact angle distribution on the wafer

software with intuitive operation

comfortable documentation of the measuring results in protocols and in the video images,

if required computation of free surface energy by the theory of Wu / OWRK

optional use with laptop or PC

The modification of the wetting behavior of silicon wafers is a standard process step in the semiconductor technology. For process characterization, adjustment of technological parameters and production control. It is therefore absolutely necessary, to measure the contact angle and the surface free energy objectively and accurately before and after the modification process.

For this purpose a robust and easy to use contact angle measuring instrument is needed. SURFTENSHL was developed to meet the needs in semiconductor technology and research The operation is simple and for everybody possible after a short training. The manual operation ensures an attractive price.

Thus SURFTENSHL is used as well as in standard process control as well as in research and development.

In connection with the software »SURFTENS« the contact angle and, if required, the free surface energy of solids can be measured. The comfortable documentation functions are a powerful help in quality assurance and research.

Basically the measuring software SURFTENS makes possible the fully automatic measurement of the contact angle of a sessile drop by different fitting methods of the drop shape. The drop is automatically detected by image processing methods. In case of critical contrast situation the software offers additional options for the drop detection like the manual setting of the baseline and the completely manual measurement of the contact angle by setting of measuring points on the monitor.

The scope of services is extended by additional measuring and service functions like:

real time display of current contact angle at the live video image,

automatic measurement of the time dependent contact angle and display in diagrams (cycle time freely selectable up to 50 values / sec.),

measurement of advancing- and receding-contact angle at the live video image,

simultaneous measurement of left- and right-side contact angle,

drop volume detection during dispensation and after drop placement

The software contains an evaluation module (theory by OWRK / Wu) for computation of the free surface energy of solids from the measured contact angles of up to 5 measuring liquids.

Very helpful is the possibility of the acquisition of AVI-files from the live video stream. All measuring- and documentation functions are afterwards applicable to the complete film or any single image of the film.

The measuring results can be stored comfortable in protocols or the video image.

The measuring accuracy is determined by using the live video image. Because a real drop of liquid changes itself permanently due to environmental influences like evaporation, the given technical parameters are related to the measurement of a contact angle standard.

 

Parameters:

resolution of contact angle measurement: 0,05°

reproducibility of contact angle measurement: +/- 0,1°

accuracy of contact angle measurement: +/- 0,5°

On inquiry numerous additional hardware options are available like 2x or 3x dosing systems or automatic, motorized and software controlled dosing units. Other options like thermal chamber, tilting stage, software for pendant drop measurement or a fully automatic measuring equipment are available with other instrument types. Please check for this options our SURFTENS-universal, SURFTENS-automatic and SURFTENS WH 300.

 

This features are for the standard equipment and can be adapted to other technical requirements.

The technical parameters are subject to change without notice.

Binding are the technical specifications as per quotation.