Optical metrology · Software development · Image processing

Optical metrology · Software development · Image processing

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    • Contact angle, surface tension

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    • drawing die and wire measurement

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    • Semiconductor technology, Micro scriber

    • Measuring microscopes, Image processing

    • Flatness, Bow, Warp, curvature, glass thickness

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We would like to have been in contact with you at the trade fairs listed below to demonstrate our products and services.

Unfortunately, due to the corona pandemic, this is not possible.

We hope to see you again at one of our exhibition stands in 2021!



OEG on wire 2020


OEG on Optatec 2020

OEG on wire 2020

DGMS-Drawing Die Geometry Measuring System features the measurement of diameter, roundness, reduction angle and bearing length of wire drawing dies.


New date: 7.-11. december 2020

• Location: Messe Düsseldorf

• Booth: Hall 13, Booth B73



May we introduce: RINGMASTER 2nd Generation
RINGMASTER has been a synonym for measuring accuracy and reliability in the measurement of drawing rings in the beverage can industry for 20 years.



We are happy to be available in Hall 1 at Stand 1E20 to demonstrate the high accuracy of our RINGMASTER, PUNCHMASTER and URP measuring devices, even under exhibition conditions!


Let us convince you of the further improved next generation of our measuring devices!


New date: 23. – 27. February 2021

• Location: Messe Essen

• Booth: Hall 1 Booth 1E20



OEG on Optatec 2020

New! MTF Micro: Measurement of the MTF of micro optics on the axis and in the image field for 100% control in production, simultaneous measurement of the focal length, measurement time 10 seconds!


MTF Master 200: the ideal solution for MTF measurement of sensor optics with small EFL and large object angle. MTF master 200 features the measurement of MTF off axis up to 2w=200°. Additionally, many other parameters can be measured.




We look forward to welcoming you to demonstrate our devices.



New date: 17.-19. November 2020

• Location: Frankfurt/Main

• Booth: Hall 3.0 Booth D56