Optical metrology · Software development · Image processing

Optical metrology · Software development · Image processing

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OEG GmbH

Products > Micro scriber, Wafer contact angle, wafer stress measurement

SURFTENS WH 300

The leading equipment for professional use in 200 and 300 mm wafer processing in semiconductor technology. SURFTENS WH 3 …

 

 

SURFTENS HL Wafer Contact Angle Goniometer

Contact angle meter, special solution for Wafers up to 200mm

 

 

SURFTENS HL automatic

Fully automatic contact angle meter for silicon wafers up to 12 inch

 

 

MR200

Precision micro diamond scriber MR200

Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers

 

 

Edge Bead Removal (EBR) Measuring System

The EBR Measuring System serves for the measurement of the edge bead removal of silicon wafers

 

 

FLATSCAN Waferstress Measuring Instrument

Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculati …

 

 

Line width measurement

COMEF is an image processing software with special functions for the highly accurate measurement of line width and line  …