FLATSCAN serves for the contactless measurement of the surface profile and the calculation of thin film stress (waferstress) of all kinds of reflecting surfaces. This includes silicon wafers, mirrors, x-ray-mirrors (goebel-mirrors), metal surfaces or polished polymers. The optical measurement principle ensures a high measuring accuracy.

For applications in semiconductor technology the thin film stress in coatings can be calculated by the measured radii before and after coating.

The standard measuring field diameter is 300mm.

 

FLATSCAN is featured by a high measuring accuracy. The surface form reproducibility amounts to 100nm.

The measuring range is the smallest measurable radius of curvature, which can be measured during one scan.

Scan length 100mm: Rmin 25m/ ±0,1m, Rmax ›10km/±1.5km

Scan length 200mm: Rmin 51m/±0.2m, Rmax ›20km/±3km

Scan length 300mm: Rmin 75m/±0.3m, Rmax ›30km/±4,5km

 

 

Depending on device type, single line scans or complete 3D scans can be accomplished.

The 3D-scans are assembled from numerous single line scans with automatic specimen positioning.

For use in semiconductor technology and for all applications, where surface modifications (like coating or removal of coatings) are accomplished, the software is equipped with a module for the calculation of the thin film stress by the Fowkes theory.

The thin film stress is calculated from the mean radius of curvature before and after the coating process.

 

* standard equipment, can be adapted to othet demands

** Standard deviation at 50 measurements of the same scan with a standard specimen under standard measuring conditions